Qualification Results

Clare conducted a variety of Reliability Stresses to qualify lead free components. Tables 1, 2, 3, & 4 provide the Reliability results associated with industry standards, stress conditions, and sample sizes that were used for the qualification. The Reliability data that were collected and that are presented here were carefully selected in order to be representative of all of Clare’s available packaging.

Whisker Study Results

Clare recognizes the industry wide concern for Tin whiskers and so performed a study on the growth of Tin whiskers. For whisker growth study, accelerated test conditions recommended by NEMI (The National Electronics Manufacturing Initiative) were used. The extensive study under NEMI’s accelerated conditions did not reveal any whisker growth, which indicated that the Matte Tin lead free process is robust and not susceptible to whisker growth. The results from the whisker study is given below in Table 5:

In addition to Clare’s whisker study, an extensive whisker study was also performed at each of Clare’s Assembly sites: ATEC and Carsem. Whisker study results from each of the assembly sites are given in Table-6.

Summary Results for Lead Free Qualification:

The qualification of Lead Free assembly using Matte Tin plating is completed and complies with Clare’s reliability guidelines because all of the reliability stresses chosen for this qualification have passed and met the release criteria. NEMI-recommended Whisker Growth tests indicated no concern because no whiskers were grown under the accelerated conditions recommended by NEMI. Therefore, Lead Free assembly using Matte Tin plating was released for production.